Metal pre-treatment scrubbing. Surface Scrubbing for trimming after drilling and enhance plate adhesion

To reduce the occurrence of excessive copper powder on the area around the hole of the surface.
Brush may be used to prevent hole clogging of buff scraps and other hole clogging.

Scrub to obtain optimum surface roughness for adhesion of Dry film.

Acid washing may be inserted prior to scrubbing. The efficiency of etching will be varied according to the chemical manufacturers.

Perform surface cleaning and conditioning after pattern formation. This is a scrubbing process to enhance adhesion of resist ink.

It is essential to select Buff with great care and attention to prevent from occurrence of disconnection or short out between individual patterns after pattern formation.

Surface scrubbing of SUS board for pressing multi-layer board

Amount of resin adhere to SUS board is varied according to processing method. Resins around pin hole should be removed in the preceding processes. Also, require careful attention with specification of dry part to prevent from getting water stain.

5-1 Surface of IVH Resin Removal (Through-Hole Protection)

5.2 Removal of padding resin before forming circuit
Removal of padding resin after circuit is formed

Permanent padding (copper pastes) scrubbing of 0.1t board is the most difficult task in scrubbing process. ?We have proprietary technical know-how on such scrubbing process to prevent from rolling of the board.

6-1 Flexible Board ?Super-thin plate (Max. total thickness 60 micron)

This is the one of state-of-the-art scrubbing machine developed by us, ideal for scrubbing roughened surface after the plate processing.

6-2 Thickness Correction or Padding Ink Removal

This can be used for correcting thickness of board after the plate processing. It enables to scrub around 3 micron-per -path. Such scrubbing equipment would commonly be used where have a poor condition of plating process.